AI Memory

Samsung Elec and AMD sign MoU on AI memory, explore foundry partnership

Samsung Electronics and Advanced Micro Devices (AMD) signed a memorandum of understanding to expand their strategic partnership ‌on memory chip supplies for artificial intelligence infrastructure, the companies said ‌on Wednesday. The agreement will focus on supplying Samsung's next-generation high-bandwidth memory (HBM4) for AMD's upcoming ​Instinct MI455X AI accelerators, as well as optimised DDR5 memory for AMD's sixth-generation EPYC processors, they said in a statement. The companies will also discuss opportunities for a foundry partnership, under which Samsung could provide contract chip manufacturing ‌services for next-generation AMD ⁠products.